Structure | Miniature cable assembly (inner conductor, insulator, shield, jacket) | PCB Etched trace over dielectric over ground plane |
Integration | External component; requires connectors/soldering | Integral part of the PCB fabrication |
Shielding | Excellent. Full 360° shielding prevents signal radiation and external interference. | Limited. Ground plane shielding on one side only; susceptible to radiation/crosstalk above and to the sides. |
Signal Isolation | Exceptional. Signals in different micro-coaxes are highly isolated from each other. | Good within layer, Poor across layers. Highly dependent on spacing, guard traces, and via shielding. |
Loss @ High Freq. | Generally Lower. Especially at higher frequencies (> 10s of GHz), lower dielectric loss and controlled impedance result in less signal attenuation per unit length. | Generally Higher. Dielectric losses in the PCB material and skin effect losses become significant at very high speeds/frequencies. |
Impedance Control | Tight & Stable. Manufactured with precise geometry for specific impedance (e.g., 50Ω, 75Ω). | Good, but Varied. Requires careful trace width design and relies on consistent dielectric thickness/constant. More susceptible to etching variations and nearby structures. |
EMI Radiation | Very Low. Fields are contained within the shield. | Noticeable. Fields extend above the trace; can radiate and cause interference or emissions issues. |
Crosstalk | Very Low. Excellent shielding minimizes coupling. | Higher Risk. Requires careful trace spacing, ground plane management, and sometimes guard traces to minimize coupling between adjacent traces. |
Dispersion | Lower. Generally better performance for broadband signals. | Higher. Velocity changes slightly with frequency, potentially distorting very broadband signals. |
Complexity/Cost | Higher. Cost per unit length + cost of connectors + assembly complexity. | Lower. Minimal added cost over standard PCB fabrication (cost is in design effort and potentially higher-end materials). |
Routing Flexibility | High & Low. Flexible cables route freely around the board, but connectors/terminations restrict direct point-to-point integration. | Integrated & Constrained. Routing is limited to the PCB surface layers; requires vias to change layers, impacting signal integrity. |
Density | Lower. Cables occupy physical space above the board; challenging to route densely. | Higher. Enables dense routing of traces on the PCB surface layer(s). |
Best Suited For | External connections, connecting instruments, high-frequency/high-isolation requirements between boards/modules, extreme noise environments. | On-board routing for high-speed digital (PCle, USB, DDR, Ethernet) & RF signals (up to 10s of GHz), cost-sensitive designs where PCB integration is paramount. |