Micro Coaxial Cable factory-(FRS)

Micro-Coaxial Cables for Semiconductor Testing: Key Roles, Performance Requirements, and Application Insights - Micro Coaxial Cable factory-(FRS)

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In the semiconductor industry, where device miniaturization (e.g., 3nm–5nm process nodes) and testing precision continue to advance, micro-coaxial cables have emerged as critical components in ensuring reliable signal transmission during quality verification. Unlike standard coaxial cables, their ultra-fine structure, low signal loss, and robust shielding make them indispensable for capturing accurate data in high-frequency, space-constrained testing environments—directly impacting the efficiency of semiconductor production and the reliability of end products.

1. Core Performance Requirements for Semiconductor Testing Scenarios

Semiconductor testing demands cables that can maintain signal integrity while withstanding harsh operational conditions (e.g., repeated 插拔,narrow test chambers). Below are the non-negotiable performance metrics:

  • Characteristic Impedance Stability: Most semiconductor test systems require impedance matching (typically 50Ω or 75Ω) to avoid signal reflection. Even a ±2Ω deviation can distort high-speed test signals (e.g., 10Gbps+), leading to false pass/fail results for chips.
  • Low Insertion Loss: At the high frequencies common in semiconductor testing (5GHz–40GHz for RF/microwave chips), insertion loss must be minimized. For example, a micro-coaxial cable used in wafer-level testing should have <0.8dB/m loss at 20GHz to ensure weak test signals from tiny die are not attenuated beyond detection.
  • High Shielding Effectiveness: Electromagnetic interference (EMI) from nearby test equipment (e.g., power supplies, robotic handlers) can corrupt sensitive test data. Micro-coaxial cables for this use case need shielding 效能 >90dB at 1GHz, usually achieved via double-layer braided shields (e.g., tinned copper + aluminum foil).
  • Mechanical Durability: Test probes and cables are subjected to thousands of cycles of insertion/removal. The cable’s insulation (e.g., PTFE, FEP) must resist wear, and its conductor (typically stranded silver-plated copper) must maintain flexibility without breaking—critical for reducing downtime in high-volume production lines.

2. Key Application Scenarios in Semiconductor Testing

Micro-coaxial cables are not one-size-fits-all; their design varies by testing stage and device type:

2.1 Wafer-Level Testing (WLT)

During WLT, cables connect the test head to probe cards, which directly contact individual die on a wafer. Given the wafer’s small die pitch (often <0.5mm), micro-coaxial cables here require ultra-fine diameters (0.3mm–0.8mm outer diameter) to fit into compact probe stations. They also need low capacitance (≤10pF/m) to avoid loading the die’s input/output (I/O) ports, which could skew voltage/current test readings.

2.2 Final Device Testing (FDT)

After dicing and packaging, chips undergo FDT to validate functionality. Micro-coaxial cables in this stage connect test sockets to the test system’s signal generators and analyzers. Since packaged chips (e.g., QFP, BGA) may require multi-channel testing, cables are often bundled into flexible assemblies with precise length matching (±1mm) to ensure synchronized signal transmission across all channels.

2.3 High-Power Semiconductor Testing

For power semiconductors (e.g., IGBTs, SiC chips), testing involves high current (up to 100A) and high voltage (up to 1kV). Micro-coaxial cables for this niche need thicker conductors (e.g., 0.2mm diameter silver-plated copper) to handle current without overheating, while their insulation must have high dielectric strength (≥20kV/mm) to prevent breakdown during voltage tests.

3. Addressing Common Selection Challenges

Engineers often face trade-offs when choosing micro-coaxial cables for semiconductor testing. Here’s how to resolve key pain points:

  • Space vs. Performance: If a test setup requires ultra-thin cables but needs low loss, prioritize cables with low-dielectric-constant insulation (e.g., PTFE, εr=2.1) and stranded conductors—they balance slim profiles with signal integrity.
  • High Frequency vs. Cost: For testing <10GHz chips, cost-effective tin-plated copper shields suffice; for >20GHz applications, upgrade to silver-plated shields, which reduce skin-effect losses at high frequencies.
  • Customization Needs: Many specialized chips (e.g., automotive semiconductors) require non-standard cable lengths or connector types (e.g., SMA, MCX, MMCX). Working with manufacturers that offer custom assemblies avoids forcing test systems to adapt to off-the-shelf cables.

Choose FRS: Your Trusted Partner for Semiconductor-Grade Micro-Coaxial Cables

When precision and reliability in semiconductor testing cannot be compromised, FRS stands out as a factory with deep expertise in micro-coaxial solutions tailored to your needs. FRS’s micro-coaxial cables meet the strictest performance standards for semiconductor testing: they offer characteristic impedance tolerance as tight as ±1Ω, insertion loss <0.5dB/m at 20GHz, and shielding 效能>95dB at 1GHz—ensuring your test data is accurate and consistent.

Whether you need ultra-fine cables for wafer-level testing, length-matched assemblies for multi-channel FDT, or high-power-rated cables for SiC/IGBT testing, FRS provides end-to-end customization: from material selection (e.g., high-temperature FEP insulation for harsh test environments) to connector integration (compatible with all major probe card and test system brands). With rigorous quality control (100% impedance and loss testing before shipment) and fast lead times (2–4 weeks for custom orders), FRS helps you minimize testing downtime and maintain the highest standards for your semiconductor products.

For semiconductor testing cables that deliver uncompromised performance, FRS is the factory you can rely on.

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