dt
dI
.
2.3 Impedance Mismatches
Connector Discontinuities:
Poorly Matched Interfaces: SMA-to-SMPM transitions with impedance deviations >5 Ω reflect signals.
Impact: Standing waves cause amplitude ripple (e.g., ±3 dB at 10 GHz).
Cable Geometry Variations:
Bending: Flexing beyond minimum bend radius (e.g., <4× diameter) distorts the dielectric-core geometry, altering characteristic impedance.
Manufacturing Tolerances: Conductor diameter fluctuations (±0.01 mm) disrupt 50/75 Ω uniformity.
2.4 Thermal Effects
Dielectric Loss:
Mechanism: High temperatures increase loss tangent (
tan
tanδ) of PTFE or PE dielectrics.
Impact: Attenuation rises by 0.02 dB/m/°C above 85°C (critical in engine control units).
Thermal Expansion:
Shield Cracking: Differential expansion rates between copper shields and FEP jackets create micro-fissures, degrading shielding effectiveness (SE).
2.5 Mechanical Stress
Vibration:
Shield Abrasion: Friction in aerospace or automotive environments wears down shields, reducing SE by 10–15 dB over time.
Flex Fatigue:
Conductor Fracture: Repeated bending in robotic arms (e.g., >100,000 cycles) breaks stranded conductors, increasing insertion loss.
2.6 Material-Related Interference
Skin Effect:
High-Frequency Limitation: At >10 GHz, current crowds near the conductor surface, raising AC resistance and attenuation.
Dielectric Absorption:
Moisture Ingress: Hydrophobic materials (e.g., foamed polyethylene) mitigate moisture-induced loss at 60 GHz.
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